Skills

CAD Modeling: Siemens NX, SolidWorks, ArtiosCAD, Blender
Manufacturing Expertise: Molded fiber production, die-cutting (cardboard & corrugated), flexo & offset printing, post-print finishes (foil stamping, silkscreen)
Process & Research: DFM, DFA, usability testing, benchmarking
Prototyping: 3D printing, Kongsberg/Zünd cutting
Rendering & Visualization: KeyShot, Adobe Creative Suite, Blender (Eevee/Cycles)
Languages: Fluent in Mandarin Chinese (including supplier communication)

Awards

Dieline award 2025 - Meta Quest 3S Packaging
Dieline award 2023 - Sonos Ray & Sub Mini
IF design award 2020 - Sonos Move Packaging
IF design award 2019 - Sonos Beam Packaging
Dieline award 2019 - Sonos Essential System
Patents:
Audio Device Battery, setup tray geometry - D1061408 (2025)
Audio Device Stand, assembly aid geometry - D0891926 (2020)

School

Art Center College of Design
B.S. in Product Design, 2011

Work

Blink (by Amazon)
8.2025 - present (Contract)
Senior packaging engineer
Wired Video Doorbell, Wireless Video Doorbell, Doorbell bundles,
Flood Light bundles, Outdoor 2K+ Camera bundles, Solar Powered Bundles Packaging

Meta
4.2021 - 4.2025
Senior industrial designer
Meta Quest Pro, 3, 3S, Quest accessory lines packaging

Sonos
4.2016 - 4.2021
Senior industrial designer
Sonos Beam (gen1), Move (gen1), Ray, Sub Mini, Accessory lines packaging

K1 Packaging Group
10.2013 - 4.2016
Structural Designer
CPG (consumer goods packaging) dieline and structure design. Concept rendering and presentations